Advances in GPU computing and multi-beam mask writing are removing constraints to enable entirely curvilinear masks.
Massive rounds for AI, EDA, and manufacturing; 80 startups raise $8.4B.
Panel-level packaging is arriving not because the engineering is ready, but because wafer-level economics are breaking down.
Large systems companies are pressing EDA vendors for performance improvements to keep pace with their AI workflows. The ...
Die-to-die chiplet standards are only the beginning. Many more standards are necessary for a chiplet marketplace. A number of such standards have either had initial versions released or are in ...
Achieving energy-efficient AI systems will require pre-competitive, industry-wide collaboration on foundational capabilities.
There is no doubt that the semiconductor industry is in an era of rapid and profound transformation, driven by an increasing ...
A new technical paper, “Exploring Silent Data Corruption as a Reliability Challenge in LLM Training,” was published by ...
AI workloads are driving their adoption in data centers. On the other hand, photonic interconnects require a variety of ...
The number and variety of test interfaces, coupled with increased packaging complexity, are adding a slew of new challenges.
Combining GaN transistors with silicon-based digital circuits enables complex computing functions built directly into power ...
As DRAM technologies scale to increasingly tighter pitches, the patterning requirements exceed the limits of conventional ...
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