Micron Technology (NASDAQ:MU) announced a US$7 billion investment to build a high-bandwidth memory (HBM) chip-packaging facility in Singapore to meet rising global demand for artificial intelligence (AI) technology.

Micron Technology is investing $7 billion to build an advanced chip packaging facility in Singapore as the semiconductor giant expands its capacity to cater to booming demand for AI chips.

It's Singapore's first facility dealing with HBM, part of the AI chips that's powering companies like Nvidia and TSMC to new heights.

The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

Micron plans to invest around $7 billion over the next five years to boost memory chip production in Singapore. The company announced the investment on the same day it broke ground on a new High-Bandwidth Memory (HBM) advanced packaging facility in the city-state.

Operations are scheduled to start in 2026 with the expansion of packaging capacity beginning in 2027. Read more at straitstimes.com.

Micron Technology, Inc. (NASDAQ:MU) broke ground on a new High-Bandwidth Memory (HBM) advanced packaging facility near the company’s current facilities in Singapore. It marks Singapore’s first HBM advanced packaging facility,

Micron Technology Inc. is investing $7 billion over the next several years to expand its manufacturing footprint in Singapore, as artificial intelligence boosts demand for advanced memory chips.

Singapore can be expected to play a larger role in developing complex artificial intelligence (AI) applications when Micron's new $9.5 billion high bandwidth memory (HBM) advanced packaging facility in Woodlands becomes operational in 2026.

Micron Technology has started constructing its multi-billion-dollar packaging facility for high-bandwidth memory (HBM) in Singapore. The company will invest $7 billion in the plant, as it expects demand for HBM3E,