A team of researchers co-led by the University of California San Diego, University of Michigan, and the French National ...
Northwestern Engineering’s Departments of Mechanical Engineering and Materials Science and Engineering share a strong history of interconnected research activities, established research centers, and ...
Researchers have uncovered a way to control material behavior using sound. In a study ...
Ceramic materials are renowned for their unique properties including high compressive strength, thermal insulation and chemical stability, yet they are inherently brittle. Advances in materials ...
At Northwestern University, our first-of-its-kind materials science department collaborates extensively with our leading mechanical engineering department, resulting in a strong history of ...
The Department of Mechanical and Materials Engineering at UAB is seeking multiple highly motivated and independent postdocs to conduct research in leading-edge polymer-derived ceramic and composite ...
Carbon fibre materials are renowned for their exceptional strength-to-weight ratio, high stiffness and resistance to chemical and thermal degradation. The evolution of carbon fibre production has led ...
To synthesize the crystals, the team compressed highly ordered pyrolytic graphite to pressures as high as 20 gigapascals, ...
WEST LAFAYETTE, Ind. — Additive manufacturing — commonly known as 3D printing — has become a staple area of study across engineering disciplines because of its potential to revolutionize the design ...
The Materials program offers students a mixture of high-quality education and cutting-edge research. Faculty members carry out research in many different areas including polymers, thin films, soft ...
Rubber-like materials have outstanding damping properties because they can concurrently display flow-like and spring-like characteristics. Recently, Japanese researchers have created a novel technique ...
Managing thermal and mechanical stress in multi-die assemblies will require a detailed knowledge of how and where a device will be used, how it will be packaged, and where stresses could cause ...