The next big leap in CPU design won’t come from adding more cores, chasing smaller nodes, or stacking additional chiplets onto one CPU. That's not to say that things like AMD's 3D V-Cache aren't good, ...

Samsung has started providing more details about its backside power delivery network (BSPDN) roadmap, stating that its 2-nm process node will be optimized for this new technology when it enters mass ...

Backside power delivery is being called a game changer — a breakthrough technology and the next great enabler in CMOS scaling. It promises significant PPA advances, including faster switching, lower ...

Samsung Electronics has unveiled its latest foundry innovations and outlined its vision for the "AI era" during its Samsung Foundry Forum (SFF) event, which it holds annually at its Device Solutions ...

In brief: At its recent Foundry Forum event, Samsung revealed a fresh roadmap, showing off bleeding-edge process technologies and advanced chip packaging solutions. With breakthroughs in 2nm and 1.4nm ...

Backside power delivery reduces routing congestion at the most advanced nodes and offers significant performance improvement options. But it also adds a bunch of new challenges involving via alignment ...

Intel announced it has successfully implemented backside power delivery on a test chip, signaling the company is far ahead of its rivals with this innovation. Intel demonstrated a working Intel 4 ...

The Intel 18A process is in production and features a critical technology currently exclusive to Intel. Backside power delivery moves power circuits to the back of the chip, unlocking additional ...

TSMC revealed its plans for its N2 2nm silicon production earlier this month, and has now revealed more details about it. In addition to switching from FinFET to a gate-all-around (GAA) design using ...