One of the main challenges in developing semiconductor chip technology is making electronic components smaller and more effective. This difficulty is most noticeable in lithography, which is the ...
Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...
NexWafe’s high-throughput epitaxy tool, ProCon 2.5. Image: NexWafe German solar wafer manufacturer NexWafe has announced “key milestones” in its epitaxial wafer production which it claims can reshape ...
Oct 29, 2024, Munich – 29 October 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced it has unveiled an advance in handling and processing “the thinnest silicon power wafers ever ...
Jon Herlocker, co-founder and CEO of Tignis, sat down with Semiconductor Engineering to talk about how AI in advanced process control reduces equipment variability and corrects for process drift. What ...
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