On July 2, Samsung Electro-Mechanics announced that it has signed a definitive agreement to establish a joint venture (JV) ...

Samsung Electro-Mechanics has joined forces with Japan’s Sumitomo Chemical Group to produce core materials for glass ...

Samsung Electro-Mechanics will set up a 480 billion won ($310 million) joint venture with a Sumitomo Chemical Group unit to ...

Intel's Innovation event starts tomorrow, and to kick things off, Chipzilla is revealing more information about its work with glass substrates. It sees this technology as the best future alternative ...

Constructive view on Taiwan Semi's GCS remains despite Goldman's cautious view on it, according to analyst Ming-Chi Kuo.

Taiwan's IC substrate makers anticipate a 10-20% supply gap of T-Glass material in 2026, prompting AI and memory customers to pursue long-term contracts to ensure capacity and stabilize revenue amidst ...

Glass substrate from SKC's semiconductor substrate manufacturing subsidiary Absolics./Courtesy of Absolics TSMC, the world's largest foundry (contract chip manufacturing) corporation, disclosed ...

Advanced Chip and Circuit Materials (ACCM) today introduced Celeritas SMC (Silicon-Matched Core), a production-ready core for advanced IC substrates engineered to match the in-plane coefficient of ...

"As chipmakers look for new ways to improve system performance beyond traditional device scaling, advanced packaging has become a critical area of innovation," said Clark Tseng, Senior Director of ...

Glass-based substrates are slowly beginning to push out organic substrates – as also commonly used in PCBs – due to often superior material properties for packaging. One area where glass substrates ...