TL;DR: SK hynix will showcase its AI memory technologies at CES 2025, featuring solutions for on-device AI and next-generation AI memories. The company aims to highlight its technological ...
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Ultrathin ferroelectric capacitors for next-generation memory devices
An ultrathin ferroelectric capacitor, designed by researchers from Japan, demonstrates strong electric polarization despite ...
TL;DR: SK hynix CEO Kwak Noh-Jung unveiled the "Full Stack AI Memory Creator" vision at the SK AI Summit 2025, emphasizing collaboration to overcome AI memory challenges. SK hynix aims to lead AI ...
Ferroelectric capacitors can be made as thin as 30nm to add memory between the metallisation layers of ICs, according to ...
High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...
If you’ve noticed that your next smartphone, laptop, or PC upgrade suddenly costs noticeably more than it did a year ago, you ...
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