As new technology nodes have become available, memory has been one of the most aggressive semiconductor applications to adopt advanced process technology. The relentless demand by users of electronic ...
Discrete memory chips are arguably the most visible reminder of the opportunities and challenges for advanced semiconductor design. They are manufactured in huge quantities, becoming key drivers for ...
As process technologies continue to shrink and memory size and design complexity grow, it has become increasingly difficult to achieve high manufacturing yield. Embedded memories are the most dense ...
Embedded Dynamic Random Access Memory (eDRAM) design is rapidly evolving to meet the escalating performance and energy efficiency demands of contemporary processors. This technology has emerged as a ...
Design-for-test (DFT) engineers often struggle to develop a memory built-in self-test (BIST) grouping plan, deciding which memories belong to which BIST group, to improve test time, routing effort, ...
Memory test at-speed isn't easy but can be achieved by balancing test selection, area overhead, and test-time constraints. The semiconductor industry has intensified its focus on yield issues to meet ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback