Toshiba is starting mass production of white LED packages that offer a cost-competitive alternative to current LED packaging options by eliminating the expensive sapphire substrate. Toshiba is ...

TOKYO — Sanyo Electric Co. Ltd. has moved one step ahead in system-in-package technology with its Integrated System in Board (ISB) packaging approach. Sanyo's solution takes multiple ICs, transistors ...

With major manufacturers racing to make smartphones ever thinner, ways to minimize the size of smartphone components have become increasingly sought after. Demand is soaring for mobile device ...

Samsung Electro-Mechanics (Semco) is poised to step into the server package substrate sector with plans to build new production lines for high-end ABF substrates in South Korea and Southeast Asia to ...