Today’s 3D integrated circuit (3D-IC) technology is the culmination of 40 years of research in universities and laboratories scattered across the globe. Beginning with dynamic random-access memory ...
Multi-scale 3D CT imaging enables digital twinning, high-fidelity simulation of composite structures
Paul Compston, CEO and director; Silvano Sommacal, technical lead, Advanced Diagnostics Division; and John Holmes, senior engineer, New Frontier Technologies Shown here is the laser tape placement ...
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