All Circuits Expects Expanded Plant to Be Largest in France in 2 Years
WEBJul 1, 2022 · MEUNG-SUR-LOIRE, FRANCE -- All Circuits this week inaugurated its new electronics manufacturing factory here, where it intends to supplier electronic assemblies to the automotive sector. The company will eventually install 13 SMT lines, reportedly making it the highest-volume EMS site in France.
Tackling Head-in-Pillow Defects with Vapor Phase Reflow - Circuits …
WEBHead-in-pillow (HiP) defects are one of the most common issues that affect printed circuit boards containing ball grid array/land grid array (BGA/LGA) packages. These defects can result in costly repairs and reduce a component’s lifespan. HiP defects are compromised solder joints often attributed to undesired environmental factors during the reflow process.
PCB Matrix Launches V7.01 IPC-7351 Land Pattern Calculator
WEBThe free V7.01 IPC-7351 Land Pattern Calculator is said to generate results that match the LP Viewer library documentation. Component families that have been added: aluminum electrolytic capacitors; 2-pin crystals, and land grid arrays. Is a scaled-down version of the LP Wizard. Calculates CAD library parts that comply with the latest IPC-7351 ...
WEBThis amount was applied in the tin/lead experiment. For a no-clean, alcohol flux of 1.5 percent solids, the amount to apply on the test board is: Area board = 100 * 160 mm2 = 24.8 in2. Amount of (wet) flux per board = solid content flux * area * required amount dry flux = 100/1.5 * 24.8 * 0.0016 = 2.645 g.
TRI Releases TR7700QE-S 3-D AOI - Circuits Assembly
WEBMar 19, 2020 · TRI Releases TR7700QE-S 3-D AOI. Published: 19 March 2020. TR7700QE-S 3-D AOI inspects and detects defects in wire bonds, die bonds, SMD, bumps, wafer IC/chip, underfill, and solder joints. Metrology capabilities provide high accuracy and repeatability. Has 5.5µm high-resolution 12MP imaging technology.
Understanding 3D AOI, What It Is, and What It Isn’t - Circuits …
WEBDec 1, 2013 · Figure 5. The same part in 3D. Currently, AOI systems come with different levels of 3D coverage for components and solder joints. All 3D systems still offer 2D lighting and 2D inspection. It is for the AOI programmer or the QA department to decide to what extent they’d like to deploy new technology for quality assurance.
Mitigation of Head-in-Pillow Defect - Circuits Assembly
WEBMay 19, 2017 · Head-in-pillow (HiP), also known as head-on-pillow (HoP) or ball in socket, is a solder joint defect that occurs mainly with BGA, CSP and package-on-package (PoP) components. During reflow, both the solder paste and solder ball melt. However, melted solder at the component ball and PCB pad do not join or coalesce after reflow.
Circuits Assembly Online Magazine - American Semiconductor …
WEBMILPITAS, Calif. – February 2, 2022 – SEMI, the industry association representing the global electronics design and manufacturing supply chain, and the American Semiconductor Academy (ASA) Initiative, a collaborative national education network of faculty at universities and colleges across the U.S. who are engaged in semiconductor research and education, today announced a partnership to ...
Jabil Signs $1B Deal to Acquire Johnson & Johnson Medical Sites
WEBPETERSBURG, FL – Jabil will acquire the manufacturing operations of Johnson & Johnson Medical Devices in an $80 million deal. The acquisition covers J&J's endoscopy, surgical, spine, trauma and instrumentation devices, according to published reports. As part of the deal, Jabil will acquire 14 sites. Jabil expects annual revenue to grow to ...
Naprotek Acquires MicroFab in EMS Rollup - Circuits Assembly
WEBPublished: 09 August 2022. by Mike Buetow. SAN JOSE -- Naprotek has completed the acquisition of privately held MicroFab, adding RF products and services to its electronics manufacturing mix. The business and entire MicroFab team will be integrated into the East Coast operations at SemiGen, which Naprotek acquired last fall.